Single element metals and aluminum alloys
Research techniques: Simulation and experimental modeling, high temperature evaluation, micro/ nano-scale evaluation, fatigue, creep and fracture evaluation, material imaging and characterization, etc.
Aluminum (Al) and copper (Cu) are two of the most commonly used single element metals across all different industries. As we all know, aluminum is recognized for its lightweight and cost, whereas copper for its excellent thermal and electrical conductivity. On the other hand, although we commonly know gold (Au) as a monetary standard for its highly appraised value, small amounts of gold can be found in microchips due to its excellent electrical conductivity and corrosion resistance. Nickel (Ni) is also one of the common material used to make coins, but possess great strength in elevated temperatures and corrosion resistance.
Extensive usage of these common metals indicates that a huge pool of research works have already reported their material behaviors and are well verified in the bulk scale. For this specific reason, these materials act as an ideal reference material for the development of new characterization techniques, or when it comes to separating the extrinsic and intrinsic behavior of the material in various processing and environmental conditions. Therefore, our research works focus on utilizing these well known materials to validate the mechanical testing techniques we developed in the micro/ nano-scale and to specifically set apart its intrinsic behavior from the multilayer passivation effects and boron addition effects. In addition, as the material behaviors and deformation mechanisms in the micro/ nano-scale differ from its bulk counterparts, emphasis is also placed on investigating the deformation behavior of these materials under cyclic loading and creep tests.
On the other hand, efforts have been made in alloying multiple elements into aluminum to overcome its lack of strength. Different elements have been added to form a long list of aluminum alloys, but most of them comes at the expense of ductility with the improvement of strength. Out of all the different elements, carbon (C) is known to possess exceptional strength while also being lightweight. However, the addition of carbon into bulk aluminum alloys often favors the unavoidable formation of carbide due to the processing methods. On the other hand, in our recent works, it was shown that co-sputter deposited Al-C films exhibit improvements in strength at minimal loss of ductility. Carbides were not formed, but instead the segregation of carbon atoms and the formation of Cottrell atmosphere were identified to be the origin of the strengthening mechanisms. Our research works then follows through the understanding of carbon additions into other aluminum alloys at micro/ nano-scales.
Aluminum (Al) and copper (Cu) are two of the most commonly used single element metals across all different industries. As we all know, aluminum is recognized for its lightweight and cost, whereas copper for its excellent thermal and electrical conductivity. On the other hand, although we commonly know gold (Au) as a monetary standard for its highly appraised value, small amounts of gold can be found in microchips due to its excellent electrical conductivity and corrosion resistance. Nickel (Ni) is also one of the common material used to make coins, but possess great strength in elevated temperatures and corrosion resistance.
Extensive usage of these common metals indicates that a huge pool of research works have already reported their material behaviors and are well verified in the bulk scale. For this specific reason, these materials act as an ideal reference material for the development of new characterization techniques, or when it comes to separating the extrinsic and intrinsic behavior of the material in various processing and environmental conditions. Therefore, our research works focus on utilizing these well known materials to validate the mechanical testing techniques we developed in the micro/ nano-scale and to specifically set apart its intrinsic behavior from the multilayer passivation effects and boron addition effects. In addition, as the material behaviors and deformation mechanisms in the micro/ nano-scale differ from its bulk counterparts, emphasis is also placed on investigating the deformation behavior of these materials under cyclic loading and creep tests.
On the other hand, efforts have been made in alloying multiple elements into aluminum to overcome its lack of strength. Different elements have been added to form a long list of aluminum alloys, but most of them comes at the expense of ductility with the improvement of strength. Out of all the different elements, carbon (C) is known to possess exceptional strength while also being lightweight. However, the addition of carbon into bulk aluminum alloys often favors the unavoidable formation of carbide due to the processing methods. On the other hand, in our recent works, it was shown that co-sputter deposited Al-C films exhibit improvements in strength at minimal loss of ductility. Carbides were not formed, but instead the segregation of carbon atoms and the formation of Cottrell atmosphere were identified to be the origin of the strengthening mechanisms. Our research works then follows through the understanding of carbon additions into other aluminum alloys at micro/ nano-scales.
Read more in our publications:
[1] Choi, J. H., Ryu, H., Sim, G. D. (2024). Elastic Size Effect of Single Crystal Copper Beams under Combined Loading of Torsion and Bending, Thin-Walled Structures, 197, 111602.
[2] Choi, J. H., Ryu, H., Lim, K. H., Kim, J. Y., Kim, H., Sim, G. D. (2023). Effect of Strain Gradient on Elastic and Plastic Size Dependency in Polycrystalline Copper, International Journal of Plasticity, 171, 103824.
[3] Kim, H., Choi, J. H., Park, Y., Choi, S., & Sim, G. D. (2023). Mechanical characterization of thin films via constant strain rate membrane deflection experiments. Journal of the Mechanics and Physics of Solids, 173, 105209.
[4] Oh, I., Kim, H., Son, H., Nam, S., Choi, H., & Sim, G. D. (2023). Combinatorial experiments for discovering Al-C thin films with high strength and ductility. International Journal of Plasticity, 161, 103515.
[1] Choi, J. H., Ryu, H., Sim, G. D. (2024). Elastic Size Effect of Single Crystal Copper Beams under Combined Loading of Torsion and Bending, Thin-Walled Structures, 197, 111602.
[2] Choi, J. H., Ryu, H., Lim, K. H., Kim, J. Y., Kim, H., Sim, G. D. (2023). Effect of Strain Gradient on Elastic and Plastic Size Dependency in Polycrystalline Copper, International Journal of Plasticity, 171, 103824.
[3] Kim, H., Choi, J. H., Park, Y., Choi, S., & Sim, G. D. (2023). Mechanical characterization of thin films via constant strain rate membrane deflection experiments. Journal of the Mechanics and Physics of Solids, 173, 105209.
[4] Oh, I., Kim, H., Son, H., Nam, S., Choi, H., & Sim, G. D. (2023). Combinatorial experiments for discovering Al-C thin films with high strength and ductility. International Journal of Plasticity, 161, 103515.
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Updated on 2025.04.05
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